17 January 2025: Mondi, a global leader in sustainable packaging and paper, is proud that ten of its innovative products have received WorldStar Packaging Awards in 2025. The awards, organised annually by the World Packaging
17 January 2025: Konica Minolta, a global leader in advanced imaging and business solutions, has successfully concluded its participation at Consumer Electronics Imaging Fair (CEIF) 2025, held from January 9th to 11th at Pragati Maidan,
17 January 2025: Creality, a global leader in 3D printing, showcased its latest innovations CES 2025, with a focus on empowering creativity and advancing 3D printing technology. Building on the theme of "Time-Tested, Future-Ready", Creality
17 January 2025: RFID market is expected to reach USD 25.24 billion by 2033, up from USD 12.61 billion in 2025, at a CAGR of 9.1% from 2025 to 2033 according to a new report
16 January 2025: India showcased its growing strength in the textile industry as Minister of Textiles inaugurated India Pavilion at Heimtextil 2025, held at Messe Frankfurt. With the largest country participation at this prestigious global
16 January 2025: At Hunkeler Innovationdays 2025, HEIDELBERG will be presenting the Jetfire 50 in the HEIDELBERG design for the first time, as a key component of a comprehensive digital ecosystem. World premiere of Stahlfolder Fireline
15 January 2025: The upcoming edition of Paperworld India, co-located with the Corporate Gifts Show, is set to be held at Bombay Exhibition Centre from 23 - 25 January 2025 in India's vibrant business hub
16 January 2025: TOPPAN Digital Inc., a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc., will participate in Paris Packaging Week 2025, one of Europe’s largest international events for luxury packaging, which
15 January 2025: A unique opportunity to see and test digital, offset and post-print production on a single site is now a reality with the opening in Radebeul, Germany, of a dedicated hall for the
14 January 2025: Avery Dennison South Asia a global leader in materials science and packaging solutions, has announced the launch of its Premium Labels range. This new offering includes a portfolio of textured substrates for
