05 November 2025: FESPA is growing its event portfolio with two new launches - Corrugated and Textile - both of which will debut at FESPA 2026 from 19-22 May 2026 in Barcelona. Corrugated is a joint
04 November 2025: From 24-26 February 2026, professionals in printed electronics from all over the world will meet again in Munich at LOPEC. The leading trade fair and the most important conference for flexible, organic,
04 November 2025: Insight Print Communications, India’s largest channel partner for HP Latex printers has announced successful installation of the HP Latex R530 printer at Krupa Enterprise, a leading service-oriented printing company based in Vadodara. Founded
01 November 2025: Avery Dennison® Graphics Solutions (NYSE:AVY) today announced the release of Neo™ Matte Black Paint Protection Film (PPF), an exciting addition to its premium wet-apply color PPF line. This highly anticipated film joins
31 October 2025: Cosmo Plastech, the rigid packaging business of Cosmo Films, a global leader in specialty films, today announces the strategic expansion of its product portfolio – now also catering to the pharmaceutical sector.
30 October 2025: The ColorJet Pavilion at ITMA Asia + CITME Singapore was inaugurated by Shri Rohit Kansal, Additional Secretary, Ministry of Textiles, Government of India. The event was graced by the presence of the
29 October 2025: Kornit Digital Ltd., a global pioneer in sustainable, on-demand digital fashion and textile production technologies, today announced a major industry milestone: the commercial launch of its groundbreaking digital footwear solution for sports
29 October 2025: The region’s leading textile machinery exhibition ITMA ASIA + CITME, Singapore 2025 opens today at the Singapore Expo. The ceremony was officiated by Mr Alvin Tan, Minister of State, Ministry of Trade
28 October 2025: The Industrial Print Integration (IPI) Conference 2025, organised by ESMA, brings together the leading voices in functional and industrial printing for two days of innovation, collaboration, and inspiration. Taking place from 12-13
28 October 2025: Union Electronics and IT Minister Ashwini Vaishnaw announced the approval of first trench of 7 projects under the Electronics Components Manufacturing Scheme (ECMS). Now Multi-Layer Printed Circuit Boards (PCBs) , HDI PCBs,
