SUSS and Manz Asia Partner on Semiconductor Inkjet Technology

08 September 2026: SUSS and Manz Asia announced a development partnership on 3 September 2026 through a corporate release issued from Garching, Germany. They will combine semiconductor process knowledge and inkjet engineering to develop semiconductor inkjet technology for advanced packaging, including panel-level packaging, where selective material deposition could cut waste and handle complex surfaces.

What will the semiconductor inkjet technology partnership cover ?

According to the official SUSS announcement, the companies intend to jointly develop inkjet systems for semiconductor manufacturing and advanced packaging. SUSS brings semiconductor process equipment and packaging experience, while Manz Asia contributes inkjet equipment, engineering knowledge and access to the developing panel-level packaging market.

The release points to four practical goals:

• develop coating methods for complex semiconductor structures;
• place material only where the process requires it;
• shorten development cycles for future inkjet systems; and
• move qualified processes from development towards volume manufacturing.

Why does inkjet matter for advanced packaging ?

Conventional coating methods can cover more surface area than a design needs. Inkjet deposits controlled droplets only in selected locations, an additive approach that may reduce material use and support patterned coating on complex surfaces. SUSS says those traits suit advanced packaging, where package density and structural complexity continue to rise.

A SEMI advanced-packaging overview describes panel-level packaging as a move away from traditional round wafers towards a square format, which can improve area efficiency. The partners say their combined process and printing skills can help move inkjet from development towards volume manufacturing; they have not published performance data yet.

How does the agreement fit Manz Asia’s inkjet work ?

The SUSS agreement adds semiconductor process and customer access to Manz Asia’s recent inkjet partnerships. In March 2026, Manz Asia and Epson announced Lab-to-Fab inkjet equipment spanning research, pilot production and mass manufacturing. That earlier project centred on Epson printheads and Manz Asia’s equipment integration.

The new collaboration follows a wider pattern of equipment makers forming alliances around semiconductor production. Screen Print India has also reported on the Tata Electronics-ASML partnership for lithography at the planned Dholera fab. Different processes are involved, but both agreements pair specialist equipment knowledge with a manufacturing programme.

What should manufacturers watch next ?

The next useful evidence will be concrete: a named application, compatible material set, measured deposition results and a route to production qualification. Until SUSS and Manz Asia disclose those details, claims about lower costs or shorter development cycles remain targets rather than demonstrated outcomes.

Inkjet’s prospects also extend beyond chip packaging. Recent coverage of printed electronics at LOPEC 2026 showed additive processes moving into sensors, displays and energy devices, while a printed electronics R&D centre in Pune illustrates the work underway on materials, circuits and product testing. Semiconductor packaging, however, imposes its own standards for repeatability and production yield.

FAQs

What is semiconductor inkjet technology ?

It uses digitally controlled droplets to deposit functional or coating materials at selected points on a semiconductor substrate or package. The method can reduce unnecessary material coverage and create patterns on surfaces that are difficult to coat uniformly by conventional means.

Have SUSS and Manz Asia launched a commercial inkjet system ?

No. Their 3 September 2026 announcement describes a joint development effort. It names no commercial product, price, customer, production site or availability date.