TANAKA Develops Low-temperature Sintering Nano-silver Paste for Screen Printing
15 December 2021: TANAKA Kikinzoku Kogyo K.K., which operates the TANAKA Precious Metals manufacturing business has announced that TANAKA has developed low-temperature sintering nano-silver paste for printed wiring (https://tanaka-preciousmetals.com/en/products/detail/sintering-agpaste-for-print/) optimized for screen printing.
This product enables miniaturization and improved bending resistance of wiring for use in screen printing, which is a mainstream printing method used in the field of printed electronics. For this reason, it is expected to be widely used for flexible devices such as smartphones and wearable devices that need bending resistance and for improving transparency in window defoggers and other products for which demand will grow as electric vehicles become more popular.
– Paste suited to printing fine wires of 30 micrometers and less
Normally, the limit for printing wires in the screen printing process is about 50 micrometers in width. However, by combining suitable printers and screens with this paste, it is possible to print fine wires (30 micrometers and less) directly onto glass, which is a difficult medium for fine line printing, and onto other materials such as PET film and green sheets.
– Bending resistance for printed wiring
Wires printed on PET film and other bendable organic substrates (100 micrometers printed wiring) were proven to show zero breakage over 100,000 cycles when subjected to a bending test with a bending radius of 0.5 mm. This product is therefore expected to be used for flexible devices such as smartphones and wearable devices that need both flexibility and durability.
– Low resistance of 10 microohm-cm and less
When sintered at heating temperatures of around 90 C, wires have a resistance value below 10 microohm-cm, giving this product unusually low resistance even for low-temperature sintered nano-silver paste.
– Nano-silver paste optimized for screen printing
This printing paste consists of nano and submicron silver particles suited to screen printing, which is the most common printing method used in the field of printed electronics. The paste was successfully developed to create wires with good resistance to bending and improved screen printing performance through particle size control, solvent selection, and additives like polymer compounds to optimize it for screen printing.
As a result of these advantages, this product is expected to contribute greatly to a range of electronic devices that will contribute to the IoT (internet of things) society, from fine wire heating technologies that prevent glass fogging (a need that is expected to increase as electric vehicles become more popular) to healthcare-related wearable devices and 5G-oriented transparent antennas that do not compromise the view.