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TOPPAN at JPCA Show 2024 – Showcasing latest development efforts in semiconductor packaging technology

11 June 2024: TOPPAN Inc., a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc. is participating in JPCA Show 2024, which will be held at the Tokyo Big Sight international exhibition center from 12-14 June.

JPCA Show enjoys a high profile both in Japan and overseas. It showcases the latest content and solutions, including electronic circuits and mounting technologies used in all kinds of electronic, information communication, and control devices, as well as sensors and e-textiles (wearable technologies), for which applications are expanding. JPCA Show aims to provide technology information and contribute to the growth of the electronic circuit sector and related industries.

TOPPAN booth at JPCA Show 2024 will display and present solutions including FC-BGA substrates, coreless organic interposers,1 glass substrates, and LSI turnkey services. TOPPAN will also hold a seminar on June 14 as one of the exhibitor presentations.

Main solutions on show
– FC-BGA substrates
Flip Chip-Ball Grid Array (FC-BGA) substrates are high-density semiconductor packaging substrates that enable enhanced speed and multifunctionality for LSI chips. TOPPAN develops substrates with ultra-high-density wiring structures that apply its uniquely evolved build-up wiring technology and supplies products that support semiconductor process miniaturization. TOPPAN provides comprehensive support aligned with customer needs from design though manufacture to meet diverse LSI demand across wide-ranging applications, including server CPUs, AI accelerators and high-end processors for network devices.

– Coreless organic interposers (exhibited for first time)
The number of chip inputs/outputs is increasing, and miniaturization of interconnection pads is advancing. To ensure the reliability of fine pitch interconnections, interposers are required to have low coefficients of thermal expansion (CTE) close to those of chips. Increased scalability is also needed to accommodate the trend of an increasing number of heterogeneous chips. At JPCA Show 2024, TOPPAN will showcase an organic interposer with simple coreless structure that can contribute to addressing these challenges.

– Glass substrates (exhibited for first time)
TOPPAN has harnessed its proprietary glass processing technologies to form through-holes and component-mounting cavities on glass substrates and plans to apply this technology to FC-BGA substrates and interposers.

– Power semiconductors / Turnkey services
TOPPAN has a track record of more than 50 years as a partner in LSI design. In collaboration with a Japan-based foundry, TOPPAN has added turnkey services for power semiconductors to its range of device solutions.

– Silver sintering material
The rise in heat generation density accompanying the miniaturization of power semiconductors is driving the need for mounting materials with higher heat dissipation and heat resistance than solder. At JPCA 2024, TOPPAN will present a silver sintering material developed by leveraging its proprietary materials technologies.

Seminar info..
– Date & time: June 14, 2024 16:20—16:40
– Venue: Tokyo Big Sight, East Hall 3, seminar room D (NPI seminar room)0
– Title: RDL Embedded Coreless Substrate (Organic Interposer) for Heterogeneous Integration
– Speaker: Fusao Takagi, Manager, Advanced Semiconductor Packaging Development Center, Electronics Division

About JPCA Show 2024 ..
– Dates & times: 12-14 June 2024, 10:00 – 17:00
– Venue: Tokyo Big Sight, East Hall
– TOPPAN will participate in JPCA Show 2024 (East Hall 3/booth 3A-28)
– Organizers: Japan Electronics Packaging and Circuits Association, Japan Institute of Electronics Packaging, Japan Robot Association
– Official website:

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