TOPPAN at JPCA Show 2025
31 May 2025: TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc., will participate in JPCA Show 2025, which will be held at the Tokyo Big Sight International Exhibition Center from 04-06 June. JPCA Show enjoys a high profile both in Japan and overseas. It showcases the latest content and solutions, including electronic circuits, mounting technologies, sensors, and wearable technologies and aims to provide technical insights and new ideas to contribute to the growth of the electronic circuit sector and related industries.
The TOPPAN booth at JPCA Show 2025 will present FC-BGA substrates as well as technologies and components for next-generation semiconductor packaging.
Main Solutions on Show …..
1) FC-BGA substrates
Flip Chip-Ball Grid Array (FC-BGA) substrates are high-density semiconductor packaging substrates that enable enhanced speed and multifunctionality for LSI chips. They are used in sectors ranging from industrial equipment to consumer products and particularly for digital devices with large numbers of I/Os (signal counts). The TOPPAN booth at JPCA Show will feature FC-BGA substrates applied in advanced LSI for generative AI and communication devices, including FC-BGAs for next-generation semiconductor packaging that supports chiplet structures,1 as well as high-speed data transmission FC-BGAs for close mounting of optical devices and LSI.
2) Next-generation semiconductor packaging
The constantly evolving functions of generative AI are driving increasing complexity in LSI data processing. It is becoming difficult to support higher levels of integration and expanded transmission bands with conventional FC-BGAs. TOPPAN is therefore focusing efforts on developing next-generation semiconductor packaging using glass and organic materials. The TOPPAN booth will showcase advanced semiconductor packaging components and technologies, including glass panel substrates with through-glass vias and high-precision cavities,2 as well as coreless organic RDL interposers.3
About JPCA Show 2025
Dates & times: 04-06 June 2025, 10:00 – 17:00
Venue: Tokyo Big Sight, East Hall 7
*TOPPAN will participate in JPCA Show 2025 (East Hall 7/booth 7D-02)
Organizer: Japan Electronics Packaging and Circuits Association
Official website: https://www.jpcashow.com/show2025/en/index.html
1. A semiconductor packaging technology in which multiple semiconductor chips are integrated on a substrate.
2. A technology for creating spaces for mounting components on a substrate.
3. A substrate used for electrically connecting front and rear circuits with through-mold vias.
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