14 February 2025: Top Employers Institute has certified PUMA as a Top Employer for the sixth time since 2020. The Top Employer certification for its worldwide operations as well as 50 different countries for the
14 February 2025: ColorJet India Ltd., a leading manufacturer of digital textile printing solutions, had the privilege of hosting Giriraj Singh, Hon’ble Union Minister of Textiles; Pabitra Margherita, Hon’ble Union Minister of State for External
13 February 2025: Union Minister of Textiles inaugurated Garment Technology, Dyes & chemicals, Handicraft events at India Expo Centre & Mart, Greater Noida by lighting the lamp. The Greater Noida event is being held under
13 February 2025: Organised by ESMA, the European Specialist Printing Manufacturers Association, Screen Print Innovations (SPI) stands as the leading global event dedicated to screen printing. Unlike other trade shows where screen printing is a
13 February 2025: Under the theme 'The Power to Move', Canon, as the headline sponsor of Gulf Print & Pack (GPP) KSA 2025, recently revealed its most advanced suite of digital printing innovations in Riyadh.
12 February 2025: Paris Packaging Week 2025 has set a new benchmark, welcoming an unprecedented 12,588 visitors - a 27% increase from last year - marking the highest attendance in the event's 24-year history. Over
12 February 2024: CDAC-Noida a research organization of MeitY signed a Letter of Intent (LoI) with Creative Play Lab, a department of the LEGO Group under the project ‘Development of Electronics and IT-based Control and
10 February 2025: At the turn of the new year, Vietnam's textile industry is poised to celebrate a significant milestone achieved in 2024: it is likely to have overtaken Bangladesh as the world's second-largest garment
10 February 2025: Nazdar Ink Technologies is thrilled to collaborate with the Georgia Institute of Technology’s Digital Design and Manufacturing Lab to explore advancements in 3D printing through a novel process known as Radio Frequency
08 February 2025: Electronic capability has improved in every way, bar one: the form factor of electronics today still mostly consists of components on circuit boards packaged in a box. The race to faster, smaller
