19 March 2026: Global Standard is pleased to announce the release of GOTS Version 8.0, the latest update to the world’s leading processing standard for organic textiles. The updated Standard strengthens requirements for air emissions
19 April 2026: TOPPAN Holdings Inc. (TOPPAN Holdings) and subsidiary TOPPAN Digital Inc. (TOPPAN Digital) have both received the Award for Encouragement of Research at the fiscal 2025 Research Presentation Meeting held by the Japanese
19 March 2026: Driven by shifting geopolitics, stricter regulation, and accelerating technology, the global security printing sector is undergoing a fundamental transformation. What was once focused on producing secure physical items - banknotes, passports, ID
19 March 2026: LOUPE Americas, formerly Labelexpo Americas, is set to return to Chicago from 15-17 September at the Donald E. Stephens Convention Center, Rosemont. With over 400 exhibitors and refreshed networking, education and technology
18 March 2026: Sun Chemical, a global leader in packaging materials and services will bring a bold new vision to interpack 2026 with Experience. Transformation. An immersive demonstration of how materials expertise, data insight and
18 March 2026: Covestro has expanded its Specialty Films Technical Competence Center (TCC) in Shanghai, further strengthening its ability to support customers across Asia Pacific in applications ranging from smart automotive surfaces to humanoid robots
18 March 2026: India has emerged as a global hub for semiconductor design and R&D. The semiconductor development strategy is inspired by Prime Minister’s vision of Atmanirbhar Bharat and Make in India, Make for the
17 March 2026: A leading semiconductor advanced packaging equipment manufacturer Manz Asia today announced a strategic partnership with Seiko Epson Corporation (Epson) aimed at accelerating the adoption of advanced inkjet technology in semiconductor manufacturing. The
17 March 2026: National Institute of Fashion Technology Mumbai hosted its annual cultural festival, Spectrum’26, on 13 and 14 March 2026. The two-day event brought together students from NIFT and other institutions to participate in
17 March 2026: The 6th International Summit for Packaging Industry (ISPI 2026) has been organised by the Indian Institute of Packaging under the aegis of the Department of Commerce, Ministry of Commerce and Industry, Government
