23 April 2026: India’s textile sector continued to demonstrate resilience in global markets during FY 2025-26. Total textile exports, including handicrafts, increased from Rs.3,09,859.3 crore in FY 2024-25 to Rs.3,16,334.9 crore in FY 2025-26, registering
23 April 2026: Xaar is continuing to drive print innovation across the global ceramics industry, particularly for today’s largeformat tiles and slabs. The company’s printheads, unique technologies and collaborative partnerships are supporting rapid adoption of
23 April 2026: IPACK-IMA, the international exhibition dedicated to processing and packaging technologies and innovative materials, has officially begun its journey towards the 2028 edition with results that mark a new milestone in the event’s
22 April 2026: Scodix, the global leader in digital print embellishment, today announced the launch of the Scodix Ultra 7000 SHD. This first-of-its-kind digital embellishment press is engineered specifically for rigid and corrugated substrates, marking
22 April 2026: Tightening packaging regulations across the globe are forcing companies to rethink sustainability claims, material choices and cost structures. As fragmented rules give way to stricter, harmonized frameworks, the shift signals rising regulatory
22 April 2026: International flexible packaging manufacturer Korozo Group is participating at interpack 2026 with a full suite of high-performance solutions, showcasing how the company is getting the supply chain future-ready with innovative, high-performance and
21 April 2026: Roland DG has launched the EU2-1000MF, a next-generation UV flatbed printer designed to streamline rigid media production and boost throughput for sign and display businesses. Aimed at applications including signage, retail displays, exhibitions
21 April 2026: WrapFest 2026 (19-22 May 2026, Gran Via, Fira de Barcelona) is set to provide a platform for experts and professionals across the wrapping industry to exchange knowledge, discover the latest innovations and
21 April 2026: Global flexible printed circuit board (FPCB) market is projected to grow from $21.5 billion in 2024 to $41.7 billion by 2030, reflecting a compound annual growth rate (CAGR) of 12.3%, according to
20 April 2026: In a defining moment for India’s semiconductor ambitions and Odisha’s emergence as a future-ready technology destination, the foundation stone for the country’s first advanced 3D chip packaging unit was laid today at
