25 April 2026: Amcor, a global leader in developing and producing responsible packaging solutions, has made a multi-million-euro investment in a new printing line at its manufacturing facility in Hardenberg, Netherlands. The investment enhances Amcor’s
24 April 2026: Indian Day program at WEPACK 2026, the World Expo of Packaging Industry, was held with great enthusiasm at the 7A700, WEPACK Carnival Conference Zone, Hall 7. The event brought together over 150
24 April 2026: Dirk Oelschläger, Regional Sales Director, Ulano Inc. explains the advantages of the solvent resistant, one-component photopolymer emulsion. ULANO has unveiled QFX Blue, the solvent resistant, one-component photopolymer emulsion. It is built for the
23 April 2026: Department of Printing Technology, Regional Institute of Printing Technology (RIPT), successfully concluded its four day online workshop on Applications of Artificial Intelligence in the Printing Industry, which was conducted over two weekends
23 April 2026: IPACK-IMA, the international exhibition dedicated to processing and packaging technologies and innovative materials, has officially begun its journey towards the 2028 edition with results that mark a new milestone in the event’s
22 April 2026: Tightening packaging regulations across the globe are forcing companies to rethink sustainability claims, material choices and cost structures. As fragmented rules give way to stricter, harmonized frameworks, the shift signals rising regulatory
22 April 2026: The Offset Printers’ Association (OPA), a leading voice of India’s printing and packaging industry, was felicitated during the Supporting Associations Appreciation & Medal Presentation Ceremony at WEPACK 2026, the World Expo of
22 April 2026: International flexible packaging manufacturer Korozo Group is participating at interpack 2026 with a full suite of high-performance solutions, showcasing how the company is getting the supply chain future-ready with innovative, high-performance and
21 April 2026: WrapFest 2026 (19-22 May 2026, Gran Via, Fira de Barcelona) is set to provide a platform for experts and professionals across the wrapping industry to exchange knowledge, discover the latest innovations and
20 April 2026: In a defining moment for India’s semiconductor ambitions and Odisha’s emergence as a future-ready technology destination, the foundation stone for the country’s first advanced 3D chip packaging unit was laid today at
